Throughout the LED industry, the mid-power LEDs have sprung up, and the output value surpassed the high-power LEDs for the first time in 2013. However, the price pressure of LEDs has not decreased without the shortage of packaged chips. According to the observation of the retail price of LED bulbs, the average retail price of global LED bulbs replacing traditional 40W incandescent lamps has dropped by about 20 this year, and the average retail price of LED bulbs replacing traditional 60W incandescent lamps has dropped by more than 25. Look, the market is still in the integration period, and it is expected that in the fourth quarter of this year, the global LED bulb average price will still have room to fall.
LED price pressure has not been reduced without packaged chips. After the LED industry enters the lighting era, it continues to face price cuts. LED factories are competing to develop unpackaged chips. LED manufacturers Philips Lumileds, Toshiba, TSMC solid-state lighting, crystal and round Packaged chip products have been introduced one after another. Following the appearance of ELC (EmbeddedLEDChip) technology and Package FreeChip, Philips Lumileds immediately introduced ChipScalePackage (wafer-level chip size package) technology, and for the first time, flip-chip Based on the high-power LED package component LUXEONQ, the unpackaged chip technology is undoubtedly a major focus of the industry in 2013.
As far as the LED lighting products are concerned, the manufacturing process is divided into Level0 to Level5. Among them, Level0 is the process of epitaxial and chip, while Level1 encapsulates the LED chip, Level2 is the LED on the PCB, and Level3 is the LED module. Level 4 is the lighting source and Level 5 is the lighting system. The LED factory has no packaged chip technology and has omitted the development of Level1.
Philips Lumileds' aggressive product line in 2013, in addition to the layout of low-power products, also recently announced the launch of high-power LED package components LUXEONQ, which is the first high-power LED developed by Philips Lumileds based on flip-chip technology. Philips ChipScalePackage (wafer level chip scale package) technology.
Philips Lumileds' latest LUXEONQ uses CSP technology and flip chip technology to achieve high power and high lumen performance. It is understood that Philips Lumileds' previous generation thin-filmflip-chip technology must remove the sapphire substrate in the back-end process, while LUXEONQ uses a new generation Flip-chip technology eliminates the need to remove sapphire substrates in the back-end process. LUXEONQ locking directly replaces the 3535 series products that are already familiar and mature in the market, including patio lights.
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